Materials Science In Semiconductor Processing

Materials Science In Semiconductor Processing英文简介

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

Materials Science In Semiconductor Processing中文简介

《Materials Science In Semiconductor Processing》是一本由ELSEVIER SCI LTD出版商出版的专业工程技术期刊，该刊创刊于1998年，刊期Bimonthly，该刊已被国际权威数据库SCI、SCIE收录。在中科院最新升级版分区表中，该刊分区信息为大类学科：工程技术 3区，小类学科：工程：电子与电气 3区；材料科学：综合 3区；物理：应用 3区；物理：凝聚态物理 3区；在JCR（Journal Citation Reports）分区等级为Q2。该刊发文范围涵盖工程：电子与电气等领域，旨在及时、准确、全面地报道国内外工程：电子与电气工作者在该领域取得的最新研究成果、工作进展及学术动态、技术革新等，促进学术交流，鼓励学术创新。2021年影响因子为4.644，平均审稿速度约1.7个月。

中科院分区最新升级版（当前数据版本：2021年12月最新升级版）

大类学科	分区	小类学科	分区	Top期刊	综述期刊
工程技术	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 PHYSICS, APPLIED 物理：应用 PHYSICS, CONDENSED MATTER 物理：凝聚态物理	3区 3区 3区 3区	否	否

JCR分区（当前数据版本：2021-2022年最新版）

JCR分区等级	JCR所属学科	分区	影响因子
Q2	MATERIALS SCIENCE, MULTIDISCIPLINARY	Q2	4.644
	PHYSICS, APPLIED	Q2
	PHYSICS, CONDENSED MATTER	Q2
	ENGINEERING, ELECTRICAL & ELECTRONIC	Q2

期刊指数

影响因子	h-index	Gold OA文章占比	研究类文章占比	OA开放访问	平均审稿速度
4.644	49	1.53%	98.85%	未开放	约1.7个月

IF值(影响因子)趋势图